EXECUTION RECORDEXR-157
Automotive-grade PCBA handoff and traceability workflow
An electronics team needed PCBA production to automotive-grade inspection standards, with full traceability from component lot to finished board and a structured handoff record for box build integration.
Starting point
Complete Gerbers, CPL, BOM with MPN, schematic, and IPC Class 3 requirement. Functional test procedure existed but had not been formally documented for production.
Execution risk
High-reliability PCBA without documented functional test procedure, AOI results, X-ray records for complex packages, and lot traceability does not meet automotive customer quality expectations and may be rejected at incoming inspection.
What KnowYi clarified
Functional test procedure formalized from existing informal test steps. Component lot traceability requirements defined before production started. Box build handoff documentation format agreed with the integration team.
What KnowYi delivered
PCBA with IPC Class 3 inspection, AOI results per board, X-ray records for BGA packages, functional test pass per board, and lot-level component traceability.
Records produced
AOI results per board, X-ray images for BGA packages, functional test record per board, component lot traceability report, delivery documentation with board serial numbers.
Why it matters
The automotive end customer required a complete traceability record linking each delivered board to its component lots and inspection records. The structured handoff record met incoming inspection requirements without rework.
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